Uf200 Prober Manual
Accretech Tsk Uf200 Uf200sa Uf3000, Find Complete Details about Accretech Tsk Uf200 Uf200sa Uf3000,Wafer Prober from Other Test Instruments Supplier or Manufacturer-csiequipmentsales.com. Uf100-1, uf150-1, uf200-1, uf250-1, uf300-1 uf350-1 uf200-2, uf300-2, uf400-2, uf500-2, uf600-2 uf700-2 uf300-3, uf450-3, uf600-3, uf750-3, uf900-3 uf1050-3 natural gas i2h lpg propane i3p important note these instructions must be read and understood before installing, commissioning, operating or servicing equipment.
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Facilities for Functional Test on Integrated Circuits
288 digital channels (256 providing up to 800Mb/s datarate, 32 providing up to 1.6Gb/s)
4.1GS arbitrary waveform generator
320MS/1GHz digitizer
1x 8 channel device power supply (max 4A/channel)
2x 4 channel device power supply (max 8A/channel)
Additional software for memory test and scan test analysis
Supports manual package test and automatic wafer test (using the UF200 wafer prober)
Tsk Uf200 Prober
Accretech UF200 wafer prober
Fully automatic wafer prober for up to 25 wafers/lot
Supports 6inch and 8inch wafers
Temperature controlled chuck, -40°C up to +125°C
256 digital channels (up to 125MHz)
4-channel Agilent power analyser
1 system configured for package test, the other system configured for wafer test
Accretech UF200A wafer prober
Standard chuck (not temperature controlled)
Spectral range 7.5 . 14µm
Temperature measurement range -40°C . 1200°C
Image size 640x480
Standard lens 1.0/30 mm
image area (30 x 23)°,
minimum distance 300mm
Microscope objective 1,0x
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image (16 x 12) mm²,
distance 50 mm, resolution 25µm
Online: up to 10 points
Offline: temperature of each pixel can be determined, additionally regions with min/max evaluation can be defined
Usage: e.g. detection of hot spots on chips (caused by shorts), thermal check of PCBs, etc
Uf200 Prober Manual Transmission
Precio™ XL
Tsk Uf3000
Precio™ XL is the latest 300mm fully automated wafer prober developed based on TEL Precio™ series. The Precio™ XL realizes high productivity, contact performance, cleanliness improvement, and short delivery time with a concept to further reduce test costs. TEL has also provided high-speed probe mark inspection TELPADS™-I and Auto Leveling (the probe card parallelism Automatic adjustment function), Users have available to them ZOOM-I which supports various Z-axis control for stable contact and soft contact, as option. The Precio™ XL wafer prober is compatible with the wafer parameters of previous Precio™ models. In addition, focusing not only on test operations but also on efficiency of setup file generation, we have introduced CoSMOz (Contact Sequence Map Optimization) software option. CoSMOz has the capability to calculate the optimum contact sequence, which was previously performed by customer test engineers. We have realized significant improvement in work efficiency and improvement in test efficiency.